Chip capacitor for high frequency application
Murata
1. Fine grained high-density ceramic dielectric, pure
gold electrode and simple single layer structure
provide very reliable performance and excellent
frequency characteristics.
2. A wide selection of sizes from very miniature
0.25mm square is suited to high-density mounting.
3. For compatibility with the gold electrodes, die
bonding with Au-Sn is possible and wire bonding
with gold wire is possible.
4. To improve handling of bonding, Au-Sn coating is
available on one side or both sides.
5. Custom made type (dimensions, cap. values, etc.)
are also available upon request.
n Applications
1. Microwave Integrated Circuits
2. Microwave Devices
3. Optical Devices
4. Measuring Equipments
