Plasma surface treatment machine for wafers
Nordson MARCH

The universal architecture of the FlexTRAK-WR system accommodates a wide range of wafer sizes in the same systems, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy.

The FlexTRAK-WR system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.). The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Its three-axis symmetrical chamber ensures all areas of the wafer are treated uniformly, while tight control over all process parameters ensures highly repeatable results.

HIGH-THROUGHPUT PROCESSING
FlexTRAK-WR system's integrated semiconductor wafer handling system provides rapid material transfer for a wide range of wafer sizes, up to 300mm (12 in.). Processing can be done from most types of wafer cassettes and front opening unified pods (FOUP). The patented chamber design and control architecture enables short plasma cycle times with very low overhead, ensuring that throughput for your application is maximized and cost of ownership is minimized.