Diamond cutting wire
Noritake Abrasives

Noritake proposes the diamond wire for the silicon ingot slicing process to replace the conventional slurry wire. Noritake's diamond wire materializes substantial reduction of environmental burden with its slurry free process and significantly improves the efficiency of the slicing process.
Two types of product, a resin bonded type and an electroplated type, are available.
Feature

1. High slicing efficiency; diamond wire vs. conventional slurry wire process.
2. High stability of slicing precision; less deteriorated layer, higher yield ratio.
3. Possible to use water-soluble fluid; better working environment, less workload in the process after slicing such as washing process.
4. Possible to reduce the consumption of wire and slurry; easy to collect the sludge, increase the possibility of reclamation of silicon.