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inspection system
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BGA inspection system


High quality, flexible and handheld Digital Video Microscope with side viewing BGA zoom lens (4x zoom factor) and brilliant image quality for Visual Inspection, Digital Image Recording and Dimensional Measurement of BGA, uBGA, CSP and Flip-Chip packages and all other SMT or Through-Hole components on printed circuit boards.

Application:

Visual Inspection of:

- Solder joints of BGA, m BGA, CSP and Flip-Chip packages
- Solder joint of SMT and through-hole components
- Assembled PCBs
- Pads
- Solder paste and flux mixtures
- Cuts and scores
- Digital Image Recording
- Software Analysis
- Non-contact Dimentional Measurements
- Documentation and Archiving
- Real time presentation


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