OSPrey800 - A revolution in OSP thickness measurement
OSPrey800This instrument measures Organic Solderablity Preservative (OSP) thickness on the individual pads of real-time production boards. The ability to target individual pads allows specific quality control, failure analysis and troubleshooting of the OSP layer. The OSPrey800%u2019s unique non-destructive quality control technique requires neither test coupons nor sample preparation and significantly reduces the time needed to take measurements and operator error.
Other techniques for measuring OSP thickness are either destructive, labor intensive, or expensive. The OSPrey800 utilizes an innovative new technique in which various wavelengths of light are aimed at a sample and the light reflected from the surface of coating and substrate is analyzed to determine coating thickness. Typical thicknesses from 0.035-3µm can be measured and analyzed.
