Palomar's Model 3500-III is designed for fully automatic, precision microelectronics assembly. The highly flexible, computer-controlled work-cell performs up to three channels of adhesive dispense, component placement, eutectic die attach, and flip chip operations over a spacious 710-in2 work area. The Model 3500-III is versatile, powerful and can provide specialized functions in addition to its primary functions Highlight Features of the Model 3500-III Die Bonder include a Large Work Area, Various Presentation Tools, Steady State and Pulse Heating Eutectic Bonding, High Accuracy Motion System, Multiple Dispense Technologies, Die Ejectors and Cognex Vision System Applications – Model 3500-III Die Bonder - Chip on board (COB) - Fine pitch SMT - Flip chip - Pick-and-Place Component Placement - High bright (HB) LED assembly - High power (HP) LED assembly - Hybrid microcircuits - Laser Diode Packaging - Micro-Electrical-Mechanical systems (MEMs) - Micro-Optical-Electrical-Mechanical systems (MOEMs) - Microwave modules - Multi-chip modules (MCMs) - Optoelectronic Packaging - RF packages - Stacked die - Epoxy Die Attach - Eutectic Die Attach - Complex Hybrid Modules