Flip-chip die bonder
3500-III PALOMAR TECHNOLOGIES

Palomar's Model 3500-III is designed for fully automatic, precision microelectronics assembly. The highly flexible, computer-controlled work-cell performs up to three channels of adhesive dispense, component placement, eutectic die attach, and flip chip operations over a spacious 710-in2 work area. The Model 3500-III is versatile, powerful and can provide specialized functions in addition to its primary functions

Highlight Features of the Model 3500-III Die Bonder include a Large Work Area, Various Presentation Tools, Steady State and Pulse Heating Eutectic Bonding, High Accuracy Motion System, Multiple Dispense Technologies, Die Ejectors and Cognex Vision System

Applications – Model 3500-III Die Bonder

- Chip on board (COB)
- Fine pitch SMT
- Flip chip
- Pick-and-Place Component Placement
- High bright (HB) LED assembly
- High power (HP) LED assembly
- Hybrid microcircuits
- Laser Diode Packaging
- Micro-Electrical-Mechanical systems (MEMs)
- Micro-Optical-Electrical-Mechanical systems (MOEMs)
- Microwave modules
- Multi-chip modules (MCMs)
- Optoelectronic Packaging
- RF packages
- Stacked die
- Epoxy Die Attach
- Eutectic Die Attach
- Complex Hybrid Modules