Multi-chip die bonder for flip chip and die attach
6500 series PALOMAR TECHNOLOGIES

Palomar's Model 6500 Precision Die Bonder is designed for fully automatic precision component assembly with 1.5µm placement accuracy (application dependent), making component assembly practical and cost effective.

Application Options

The Model 6500 CPWC is an extremely versatile piece of equipment and can provide specialized functions in addition to its primary functions.

Flip Chip Assembly

The Model 6500 Die Bonder can perform flip chip assembly for a large range of chip sizes and applications, including epoxy and eutectic die attach. It can perform flip, dip, and lookup camera alignment in any combination, in any sequence, and also out of sequence (such as for solder or epoxy applications that require an intermediate step, such as an epoxy dispense or daub).

Eutectic Die Attach

Automatic eutectic attach techniques are particularly suited for high-performance and high-capacity die attach applications, such as optoelectronic components and high-power communication devices.

Palomar's ultra high accuracy pulse heat stage (PHS) has been specially designed for the Model 6500 Die Bonder to allow controlled reflow, resulting in a stronger bond with minimum voiding - implementing a steady state heat stage if the application requires it, which is more typical for Au-Au interconnections or AuSi eutectic scrubbing applications.