Chip encapsulation compound - PANACOL-ELOSOL - DirectIndustry

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Chip encapsulation compound PanacolElosol

- UV and thermally curing
- Short curing time
- Outstanding temperature resistance
- Available in black too

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Industrial categories of this manufacturer:
> Bonding, Adhesive
> Resin, Gelcoat for Composite Material
> Bonding: Equipment and accessory
> Soldering machine, Brazing machine
> Synthetic material, Semi-finished product
> Dispensing: Equipment, Accessory

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