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chip encapsulation compound

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Chip encapsulation compound Panacol Elosol

- UV and thermally curing
- Short curing time
- Outstanding temperature resistance
- Available in black too

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| Bonding, Adhesive | Bonding: Equipment and accessory | Dispensing: Equipment, Accessory | Synthetic material, Semi-finished product | Soldering machine, Brazing machine | Resin, Gelcoat for Composite Material |

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