Epoxy die bonder
MD-P200 Panasonic Factory Automation Company

Panasonic's new MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput.

The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available.

Features & Benefits

* Wafer mapping software capability
* Low bond force option
* Epoxy writing or pin transfer
* High accuracy
* Flexible for multiple die