The Panasonic UA3P profilometer series is designed to measure aspherical lenses & molds, semiconductor wafers, and any other precision component requiring nanometer level accuracy ranging up to 200mm x 200mm. Different machine models are available to meet your optical & high aspect ratio metrology needs.
The UA3P-300, UA3P-4 and UA3P-5 all offer users the accuracy of AFM technology with the measurement range of a CMM. Our unique approach uses atomic force probe technology in the stylus and HeNe laser-based interferometric XYZ axis positioning.
Couple this technology with a solid granite-base and you have a robust metrology system that can be used on the factory floor and still deliver 0.1um level total uncertainty.
• The UA3P can measure aspherical lenses and free-form mirrors and their molds, which are essential for digital consumer electronics such as mobile phones, DSCs, DVDs, and Blu-ray recorders, as well as in home security, optical communications, and vehicle H
• Ultra-accurate measurement in only 3 minutes
• Automatic NC program generation
• Extensive library of optional software
• Easy operation supports rapid feedback to machining
Outer Dimensions (W x D x H) mm - 700 x 780 x 1,500
Mass of Main Body - 700 kg (Others: 150 kg)
Measuring Range (X, Y, Z axes) mm - 30x30x20
Measured Object Placement Area (X, Y, Z axes) mm - 100x100x100
Measuring Probe - AFP
Resolution - 0.3nm
Max. Inclination Angle for Top-Surface Measurement - 75º