* Includes microchip lasers, zigzag slabs and planar waveguides
* Epoxy-free, optical bonding for high power handling ability
* Wide range of materials including YAG, Nd:YAG, SiC, CVD and sapphire
* Zero thickness bondline with no absorption or scattering
* Bonding processes for both coated and uncoated interfaces
These high-power bonded assemblies for solid-state laser amplifiers and ocsillators use Precision Photonics’ proprietary CADB® process to produce adhesive free, composite crystal, glass and ceramic structures. Ideal for high-power laser applications for LIDAR, defense and aerospace, materials processing and medical industries, these highly robust, epoxy-free devices can be fabricated in a variety of geometries (rods with end caps, laser slabs and thin disk lasers) and form factors from 1 mm to greater than 100 mm.
The CADB process is extremely strong and offers negligible scatter and absorptive losses at the interfaces ; it also works with both IBS coated and uncoated surfaces. Our ion beam sputtered coating technology can handle damage thresholds above 40 J/cm² with less than 2 ppm bulk absorption in the coatings, making them suitable for a wide variety of high power solid state lasers and laser gain media structures including microchip lasers and Q-switch lasers with Cr4+:YAG or Co:Spinel saturable absorbers.