The flexible heating foil is the result of printed circuit technology (etched foil) and was developed in order to solve specific problems in advanced market sectors such as the space and aviation fields. In a relatively short time, the heating foil has found applications in many other fields, allowing users to solve problems of particular importance thanks to the following characteristics: - Can be set to vary heat concentrations to optimize distribution - Minimum heat dispersion in case of external application on the object to be heated - Can be molded - Easy to assemble - Overall economical in many applications - Minimum weight and thickness: · Mica 0,9 mm · Polyimide 0,15 mm · Silicone 0,8 mm · Poliestere 0,15-0,25 · Teflon 0,8 mm - Flexibility - Working temperature: ·Mica max working temperature 500° C ·Polyimide max working temperature 260° C, with adhesive 175°C ·Silicon max working temperature 200° C, with adhesive 175°C ·Polyester max working temperature 100° C, with adhesive 100°C