RMT Ltd.

Thermoelectric cooling assembly for telecom applications
ML series RMT Ltd.

  • thermoelectric cooling assembly for telecom applications ML series RMT Ltd.
The ML Series has been designed for Telecom applications. Optimized for WDM and laser diode packages such as "butterfly", HHL, DIL, miniDIL and others.

The ML Series consists of three sub-series of the same TEC types by footprint but different by applied ceramics, thus different in height and performance:

1ML06 Al2O3 subseries standard Al2O3 ceramics of 0.5 mm thickness

1ML06 AlN05 subseries AlN ceramics of 0.5 mm thickness

1ML06 AlN025 subseries AlN ceramics of 0.25 mm thickness



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