Layer thickness measurement device by PULSE technology Rudolph Technologies
The MetaPULSE® System uses patented picosecond ultrasonic laser sonar (PULSE™) technology to provide the industry's first production-worthy opaque film metrology tool. Its small-spot, non-contact, non-destructive technology enables on-product thickness measurements of single or multi-layer opaque films for aluminum and copper processes. In addition to thickness, the MetaPULSE identifies missing layers or interfacial problems such as poor adhesion, and characterizes material properties such as density and roughness. MetaPULSE is used by all of the top ten semiconductor manufacturers, and nearly 200 tools are currently providing production monitoring in fabs around the world.