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Wafer inspection and sorting machine
Rudolph Technologies

  • wafer inspection and sorting machine Rudolph Technologies
For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes. Defects created in the post-fab area between wafer processing, bump processing and final manufacturing can negatively impact product yields and time-to-market. The Wafer Scanner quickly and reliably locates bump and wafer defects, reducing process costs and improving yield.

Utilizing the Rudolph Laser Triangulation technology, Wafer Scanner enables 3D inspection of bumps and RDL of different sizes at high speed. The newly added optional Ultra High resolution sensor enables inspection of micro bumps and RDL heights of as low as 1µm.

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