3D inspection machine NSX® 330
for wafersfor the packaging industrymacro defect

3D inspection machine
3D inspection machine
3D inspection machine
Add to favorites
Compare this product
 

Characteristics

Technology
3D
Applications
for wafers
Sector
for the packaging industry
Other characteristics
macro defect, high-speed, automated

Description

The NSX 330 Series enables advanced packaging processes by directly improving the cost of ownership by enabling multiple applications in a single platform. Product Overview With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load. The NSX 330 System offers robust platform technology, including: high-acceleration staging, high-speed multi-processor computing and highly flexible software with an unprecedented level of usability. With over 1,000 NSX Systems installed worldwide, the NSX 330 System offers increased 2D inspection and metrology throughput and a broad portfolio of 3D sensors supporting critical advanced packaging applications. Applications • WLCSP • RF/MEMS • Simultaneous high accuracy topography, depth and thickness measurements • Substrate thickness, TTV, and bonded wafer thickness stack thickness (carrier, adhesive, product wafer and total stack) • Via depth (unlimited aspect ratio) • Thick and thin RST • Bow and warp Specifications • Choice of inspection platforms with hard-anodized finish which can accommodate 100mm to 330mm whole wafers • The objective turret provides flexibility for inspection applications requiring both high throughput and high resolution. The turret assembly has five (5) available slots and can be populated with any combination of 1X, 2X, 3X, 5X, 10X , 20X and 50x objectives. • Programmable light tower • Programmable illumination filter wheel • Multiple modes of dark field illumination • Standard docking module
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.