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Multi-chip package (MCP)
Samsung Semiconductor

Samsung’s MCP portfolio leverages the company’s expertise in memory design and semiconductor process technologies. Its MCPs are built using its lowpower memory technology so that mobile devices will consume as little power as possible. In addition, Samsung’s core MCP technology utilizes the company’s skills in wafer thinning, same-die stacking, wire bonding – chip to chip and long-wire bonding – and molding.

The memory chips included in Samsung MCPs are built using advanced process technologies – from 90 to 65 nanometers. The company’s ongoing investments in fabs and technology assure customers of MCPs that will stay on the leading edge.

One of the many advantages of Samsung MCPs is the consistent use of the
same packaging and footprint, which makes it easy to scale between different Samsung MCP combinations. In addition, Samsung customers are assured of broad options within the same footprint.