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Backplane connector
SAMTEC

Many Samtec board level interconnects can be configured for a "micro backplane" application. Among these are high speed, micro pitch and high density, in right angle and edge-mount board-to-board interconnect systems.

Popular "micro backplane" interconnect systems include:

MICRO TCA
The Samtec MTCA connector is fully compliant to the new µTCA™ standard architecture. The connector socket has .75mm pitch edge card interfaces, 170 position press fit tails on a staggered four row footprint, and form/fit/function compatibility with Molex.

Micro Edge Card Sockets
Micro edge card sockets are high speed board interfaces which are ideal for perpendicular (90˚) board-to-board applications.

Edge Rate System
The Edge Rate interconnect system features the rugged, high cycle Edge Rate contact system on .8mm pitch. This high speed interconnect is designed to withstand "zippering" during mating and unmating and is available in vertical, right angle, and edge mount configurations.

SEARAY™ High Density Arrays
SEARAY™ is an open pin field, high density array interconnect system. It is available with up to 500 I/Os and has the rugged Edge Rate contact system for high speed, high cycle applications. The open pin field design allows both single-ended and differential pair routings.

Q2 Edge Mount
Q2 is a rugged, high speed interconnect system available in both right angle and edge mount configurations. Optional locking screws make the system even more rugged, and guide posts are available for blind mating.