DIN connector SEARAY™ series
backplanerectangularpress-fit

DIN connector
DIN connector
DIN connector
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Characteristics

Format
DIN, backplane
Shape
rectangular
Connection type
press-fit
Electrical characteristics
high-density, grounding
Other characteristics
rugged, high-speed
Pitch

0.8 mm, 1.27 mm
(0.031 in, 0.05 in)

Description

Samtec’s SEARAY™ products are the industry’s largest offering of high speed, high density open pin field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. SEARAY™ Open Pin Field Arrays feature a .050" x .050" (1,27 mm x 1,27 mm) pitch grid for maximum grounding and routing flexibility. This system is available in stack heights from 7 mm to 40 mm with up to 500 Edge Rate® contacts. Vertical or right angle arrays (SEAM/SEAF Series) and a mating high speed cable assembly (SEAC Series) are available as 50Ω or 100Ω solutions. High retention press fit tails (SEAMP/SEAFP Series) and an 85Ω tuned interconnect (SEAMI Series) offer greater system flexibility. Elevated board stacking up to 40 mm is achieved by Samtec’s high speed, high density riser (SEAR Series). FEATURES Maximum routing and grounding flexibility Lower insertion/extraction forces vs. typical array products Performance up to 18 GHz/pair Up to 500 I/Os in open pin field design 1.27 mm (.050") pitch and space saving 0.80 mm pitch Rugged Edge Rate® contact system Can be "zippered" during mating/unmating Solder charge terminations for ease of processing Meets Extended Life Product™ (E.L.P.™) standards 7 - 17 mm stack heights Vertical, right angle, press fit 85Ω systems

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