High density connector
SAMTEC
Samtec has one of the largest selections of high density interconnects in the industry, including High Density Arrays, Open Pin Field Arrays, and FOURRAY™ Four Row interconnects.
DIFFERENTIAL PAIR ARRAYS
DP Array™
* High Speed Array System
* Staggered pin layout reduces grounds
* No return paths needed
* No grounds needed so easier board routing
* Perimeter grounds simplify routing
* Fewer board layers
* Lower insertion/withdrawal forces than SamArray™
* Unique solder crimp on tails
* 10mm (.394") mated stack height
* Differential pair
* Up to 184 usable pairs
OPEN PIN FIELD ARRAYS
SEARAY™
* .050" (1,27mm) pitch array
* High Density - Up to 500 pins
* Flexibility to route as differential pairs, single-ended, or both
* Robust contact design:
o Lower insertion/extraction forces vs. other array products
o Allows "zippering" during unmating
* Up to 17.5mm mated height
* Right angle (in design)
* Unique solder crimp on tails
* Same footprint as SamArray®
HD MEZZ™
* "Open Pin Field" design
* Intermateable with Molex Incorporated HD Mezz
* Elevated: 20, 25, 30 and 35mm stacks
* Better performance at taller stacks
* 299, 195, 143 pins
* Final Inch® information available
* HDAF, HDAM
Z Beam®
* One piece interface
* Solderless connection with compression tail
* Easy to replace
* .050" (1,27mm) pitch
* Up to 900 I/Os
* Low Profile - .065" (1,65mm) and .118" (3mm) heights available
* No solder pad delamination
* Minimizes Coefficient of Thermal Expansion issues
* No solder joint reliability or bent pin issues
* Allows field upgrade/exchange
* GFZ
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