Board-to-board connector SEARAY™ LP series

SMTDINbackplane

These low profile, high speed arrays feature a dual beam contact system on a 1.27 mm x 1.27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. This system is available in 4 mm, 4.5 mm and 5 mm mated heights with up to 320 total pins in 4, 6 or 8 row configurations.They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability. FEATURES 4 mm, 4.5 mm, 5 mm stack heights Up to 320 I/Os 4, 6 and 8 row designs .050" (1.27 mm) pitch Dual beam contact system Solder crimp termination for ease of processing Performance up to 18.5 GHz / 37 Gbps