Microprocessor heatsink with fan SANYO DENKI EUROPE

Thermal Module (Type II) for BTX

Material: Frame, Impeller, Dust: Plastics Dust seal: Rubber sponge ; Heatsink: Aluminium(Core: Copper)
Life Expectancy: 40,000 hours, indoor environment (Survival rate: 90% at 60, rated voltage, and continuously run in a free air state)
Motor Protection System: Current blocking function and Reverse polarity protection
Dielectric Strength: 50/60Hz, 500VAC, 1 minute(between lead conductor and frame)
Operating Thermally Range: 0 to 70°C (Non-condensing)
Connector: Molex P/N 47054-1000 or Wieson 2510C888-001
Contact: Molex P/N 5159PBT or Equivalent or Wieson 2511-T1

For Intel 775-land LGA Package

Material: Frame,impeller: resin mold; Heatsink:aluminium(Core:copper)
Life Expectancy: 40,000 hours, indoor environment (Survival rate: 90% at 60, rated voltage, and continuously run in a free air state)
Motor Protection System: Current blocking function (with reverse polarity protection)
Dielectric Strength: 50/60Hz, 500VAC, 1 minute (between lead conductor and frame)
Operating Thermally Range: 0 to 70°C (non-condensing)
Connector: Molex P/N 47054-1000 or Wieson 2510C888-001
Contact: Molex P/N 5159PBT or Equivalent or Wieson 2511-T1

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