Targeting next generation embedded processors built using 45nm such as Intel® Atom™ platform and VIA Technologies Inc. Isaiah at 65nm, the Qseven format will complement the low power and small size of these processors. By exploiting the small form factor of the industry’s latest processors, the Qseven format offers high performance computing power, delivered in a board measuring just 70mm x 70mm.
The Qseven platform has been developed with performance and flexibility in mind, allowing various processor configurations to maximize passive cooling technology. With a maximum power consumption of around 12W specified in the standard, the new form factor is expected to appeal to manufacturers of applications that require fanless operation. Where heat dissipation is an issue, a thermal cooling interface has been defined to help transfer any heat generated to a cooling solution.
It will also provide extensive connectivity through industry standard interfaces, including: 4x PCI Express; 2x SATA; 6x USB 2.0; 1x 1000BaseT Ethernet; 2x SDIO 8 Bit; LVDS 2x 24 Bit; DVO/SDVO (shared); VIP (Video Input Port); HDA (High Definition Audio); I²C Bus; LPC (Low Pin Count Bus).
The innovative form factor offers unparalleled flexibility in configuration. By leveraging the Mobile PCI Express Module (MXM) connector format, Qseven offers three different connector heights, from 4.3mm to 7.8mm. Through this configuration it is hoped the Qseven platform will be as simple to integrate as a DIMM memory module.
