Fully-automatic die bonder
TRIAD 05 AP SET

TRIAD 05 AP is a high accuracy automatic flip chip bonding system optimized for cost-effective volume production of optoelectronics modules with a sub-micron post-bonding accuracy.
It achieves a throughput of up to 200 units per hour with passive alignment mode.

The TRIAD 05 AP accepts piece parts with sizes in the range between 0.1 and 22 mm and with a thickness up to 25 mm. Substrate or package can be as large as 50 mm with thickness up to 22.5 mm.

An optional infrared inspection station offers the ability to measure the actual post-bonding accuracy with automatic feedback to the bonding head to tune and maintain the placement precision.