Fully-automatic ultrasonic flip chip die bonder
FC300R
SET
The FC300R offers production capabilities for Chip-to-Substrate or Chip-to-Wafer assembly as well as Chip-to-Chip stacking. With the unmatched post-bond accuracy of ± 0.5 µm, across the entire force range of the machine (up to 4,000N), the FC300R is the ideal tool for 3D-IC applications using high density TSV.
The adjunction of a loading robot to the base FC300 enables:
Larger machine autonomy by storing a large number of Waffle Pack or GELPAKTM
Automatic contactless wafer loading and unloading (200 mm and 300 mm available)
Thin die pick up from diced wafer on film frame (200 mm or 300 mm)
Components pick up from tape-on-reel feeder
Chip pre-alignment and pick up in hidden time for higher throughput.
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