Thermally conductive gap filler 1 W/m.k | H100 series
shen zhen HFC shielding product
H100 series is a compound material which was mixed with silicone resin and ceramic powder , and have 1.0W/m.k , 2.0w/m.k and 3.0w/m.k thermal conductivity and good compression performance with Low thermal impedance and price .H100 series has adhesion itself and no need to extro adhesive ,no affect for thermal conductivity ,H100 is very soft and have excellent dielectric protecties,Working temperature range |40Oto 150O and has UL recognized V-0 flammability.
