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soldering furnace / curing / chamber / gas
Falcon 1200 sikama international

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Characteristics

  • Function:

    soldering, curing

  • Configuration:

    chamber

  • Heat source:

    gas

  • Atmosphere:

    nitrogen

  • Other characteristics:

    forced convection

  • Maximum temperature:

    Min.: 0 °C (32 °F)

    Max.: 420 °C (788 °F)

Description

Sikama International’s Falcon 1200TM is a multi-purpose furnace capable of temperatures up to 420°C that can be used as a reflow solder system as well as for epoxy curing applications. Incorporating Sikama’s unique “thermal technology” based on conduction heating in combination with forced thermal convection, the Falcon 1200TM contains 1 load zone, 7 heat zones and 2 cooling zones and includes automatic load and unload buffers with appropriate sensors providing SMEMA interface connection to link into automated production lines. The system may be operated with air, nitrogen or forming gas.

Prior to entering the heat zones the temperature of the substrate is stabilized by virtue of the liquid-cooled load zone. Each heated zone has individual set point controls and gas flow controls that maintain platen temperature to within +/-2°C to ensure consistent and precise temperature for reliable, repeatable profiles. The gas is introduced into the reflow chamber through tiny perforations in the conduction heating platens and enters the chamber at the same temperature set for each zone. The internal liquid-cooled zone ensures a process cool-down in an inert atmosphere. Further cooling of the substrates is accomplished as the product exits into the liquid-cooled offload zone.