Monitoring analyzer FluoScan 3D

laboratoryfluorescencefor integration

Automated cleanliness inspection with proven fluorescence sensor technology AUTOMATED Cleanliness inspection of three-dimensional parts' surfaces QUICK Surface scan of different parts detecting residual organic contamination within a very short time RELIABLE Robust Sensor Reproducible measuring results Flexible at the process and in the laboratory Automated inspection of die cast aluminium before bonding In manufacturing processes of cast parts release agents are used. In follow-up processes such as the bonding of sealing grooves, release agent residues lead to insufficient adhesion of the bonding joint. By inspecting the cleanliness of a sealing groove via fluorescence measurement, the quality of the bonding joint is ensured. - Inspection of printed circuit boards To meet the high quality requirements of bonding and soldering processes, pads have to be free of organic contamination. By scanning the pads cleanliness can be controlled and high quality standards are ensured. Defects can be identified at an early time and thus, rejects and costly system failures can be prevented. Measuring principle The measuring method uses the characteristic of organic substances to fluoresce. UV light is focused and radiated onto the surface. The contamination fluoresces. The intensity of the fluores-cence increases with the layer thickness of the contamination. The intensity is measured in RFU: Relative Fluorescence Unit. The lower the measuring values in RFU, the cleaner the surface.