Reflow soldering oven AE-8800

semi-automaticfor PCB

Reflow principles: The Reflow oven contains multiple zones, which can be individually controlled for temperature. Generally there are several heating zones followed by one cooling zone. The PCB moves through the oven on a conveyor belt, and is therefore subjected to a controlled time-temperature profile. The speed of the conveyor can also be controlled. Heating Element: The heat source is from ceramic heaters, which transfers the heat to the assemblies by means of convection, the oven will have fans to force heated air towards the PCB. Conveyor: The PCB will travel into the heating zones by means of mesh conveyor or chain driven conveyor (depending on your model) The conveyor can be program to move from left to right or right to left. The speeds are adjustable by software. Profiler: The reflow oven will come with a build-in three point profiler. Thermal profiling is the process of plotting temperature vs. time of the PCB as it travels through the oven. The PCB thermal profile is determined by temperature, time, and heat transfer rate.