BGA rework station EA-H05

BGA rework station
BGA rework station
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Characteristics

Applications
for BGA

Description

Specifications: General Power 1600W(max) Power of top heater 720W(120W*6, infrared heating tube, wavelength about 2-8μm) Power of bottom heater (hot air) 800W(400W*2, dark infrared heater) Top heating range 20-60mm(X, Y adjustable) Bottom heating range 135*250mm Max PCB size 400*400mm Soldering Station Digital lead free soldering station Power of Soldering Station 90W Communication RS-232C(be connected with PC) Temperature sensor Non-contact infrared sensor Weight 35kg Dimension 750(L)mm*500(W)mm*680(H)mm PL Camera 22*10 times magnifying; 12V/300mA; Horizontal resolution 480 lines; PAL format Prism size 50mm*50mm BGA size range 2*2-60*60(mm) Video output signal Video signal RPC 22*10 times magnifying Horizontal resolution: 480 lines PAL format

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