BGA rework station EA-H15

BGA rework station
BGA rework station
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Characteristics

Applications
for BGA

Description

Specifications: General Power 1600W(max) Power of top heater 720W(120W*6, infrared heating tube, wavelength about 2-8μm) Power of bottom heater (hot air) 1600W(400W*4, dark infrared heater) 2000W(500W*4, high infrared heating tube, optional) Top heating range 20-60mm(X, Y adjustable) Bottom heating range 290*290mm Max PCB size 400*400mm Communication USB(be connected with PC) Temperature sensor Non-contact infrared sensor Weight 55kg Dimension 850(L)mm*650(W)mm*730(H)mm PL Camera 22*10 times magnifying; 12V/300mA; Horizontal resolution 480 lines; PAL format Prism size 50mm*50mm BGA size range 2*2-60*60(mm) Video output signal Video signal RPC 22*10 times magnifying Horizontal resolution: 480 lines PAL format

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