Reflow soldering oven F6
semi-automaticfor PCB

reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
reflow soldering oven
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Characteristics

Technique
reflow
Operating mode
semi-automatic
Applications
for PCB
Power

25,000 W

Description

Description SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax F6 systems provide optimized lead-free processing for the ultimate in productivity and efficiency. F6 reflow oven exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, adding up to the most economical LED aluminum circuit board soldering in the industry. F6 reflow oven is top 6, bottom 6 heating zones and 400 degreeC maximum temperature and equipped with fully convection. The system comes with computer control and touch screen simplified user interface and incredibly self calibration capabilities.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.