BGA rework station QK-IR2015

BGA rework station
BGA rework station
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Characteristics

Applications
for BGA

Description

Component Features: 1. IR2015 Infrared Reflow Soldering Section: Infrared temperature sensor monitors BGA surface temperature to ensure precise temperature technical window. Even heat distribution, real closed-loop control. 2. PL2015 Precise Aligning and Placing System: Visible double-color optical alignment. Accurate alignment and overlap between solder ball and soldering pad; Easy to control and place components. 3. RPC2015 Reflow Camera: The melting course of BGA solder ball can be observed from different angles which provides critical information to get accurate and reliable process curve. 4. IRsoft Software: By means of PC, the whole process can be recorded, controlled and analyzed and then g enerate the curve diagram to meet the demands of modern electronic industry.

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