Component Features:
1. IR2015 Infrared Reflow Soldering Section:
Infrared temperature sensor monitors BGA surface temperature to ensure precise
temperature technical window. Even heat distribution, real closed-loop control.
2. PL2015 Precise Aligning and Placing System:
Visible double-color optical alignment. Accurate alignment and overlap between solder
ball and soldering pad; Easy to control and place components.
3. RPC2015 Reflow Camera:
The melting course of BGA solder ball can be observed from different angles which
provides critical information to get accurate and reliable process curve.
4. IRsoft Software:
By means of PC, the whole process can be recorded, controlled and analyzed and then
g enerate the curve diagram to meet the demands of modern electronic industry.