Electronics assembly machine Sony Manufacturing Systems America

SI-F209

Compact-Sized, Fine Pitch SMT Pick & Place Equipment

The fine-pitch SMT equipment is compact (1.2 meters across) and features the new Flying Vision & Nozzle Change system that dramatically reduces time loss during head movement and reduces the gap between actual cycle time and catalog tact time. Four machines on a line require less space than a full-sized rotary head machine and can handle PWBs as large as 460mm x 360mm(LxW).

Flying Vision & Nozzle Change
Reduce loss time during head movement and minimizes the gap between actual cycle time (production cycle time) and catalog tact time through part recognition and nozzle change during head pick-up.

Flying Nozzle Change (High-Precision Mounting)
Fixed and moving cameras achieve high-precision mounting enabling the cellular mounter to handle BGA/CSP mounting with a finer grid pitch. Allowing the production line to meet smaller component and higher-density mounting requirements.

Rear Tray (Wider Parts Size Range)
Process products ranging from microchips to large connectors, feeder units accommodate up to 40 cassettes (front) and 80 trays (rear), a single machine can handle a high-density PWB.

Parts Selection Display
Standard Parts Template contains parts data. Save tedious data-entry time and shorten lead times when parts or models are changed.

Optional Handy Console
In addition to Main Control Panel operation, the (optional) Handy Console can also control the Sony cellular mounters using Microsoft Windows compatibility for basic programming and model changing operations.