Lapping machine for wafer thinning FAM59SPAW, FAM50SPAW
SPEEDFAM NV/SA
SpeedFam's 50-SPAW and 59-SPAW machines are automated single side mechanochemical polishing systems for bare silicon wafer processing. We transport ceramic mounting plates (loaded and unloaded with wafers) automatically. These systems are equipped with various advanced technologies such as a low thermal expansion polishing plates and cooling jackets, independent forced drive and precision pressure control for each process carrier.
