- Machine-tools
- Finishing Machine
- Polishing lapping machine
- SPEEDFAM NV/SA
Wafer thinning lapping machine DSM28B-5L-4Dpolishing
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Characteristics
- Options
- polishing
- Applications
- wafer thinning
Description
The 28B-5L/P is our double side lapper for 300mm wafers. At 15 pieces per batch it is ideal for mass production. This system includes the latest functions, including precision pressure plate load control and eddy current automatic thickness control, which is ideal for the best nanotopography.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.