Flip-chip die bonder
ABC200
Suss MicroTec
+ Suitable for wafer sizes from 2" to 8"
+ Unique design that cleans, dries, aligns and pre bonds two wafers in one closed chamber with specific atmosphere
+ Removes particles >= 0.1µm with high yield and throughput
+ Smallest Industry Footprint (from 1.2m x 1.4m)
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