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Suss MicroTec
Suss MicroTec
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Exhibitor's key-words
Wafer bonder
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Die bonder
|
Test system
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Test set
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Mask aligner
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Inspection machine
Wafer bonder
Suss MicroTec
For over a decade SUSS MicroTec has been a leader in advanced wafer bonding technology for the MEMS industry, offering high-performance solutions for the MEMS, 3D interconnect and Optoelecronic markets.
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8 Products
Suss MicroTec
sorted by category
Inspection machines for the electronics industry
Wafer inspection machine
DSM8
Machines for electronics production
Wafer spin coater
max. 200 mm | ACS200Plus
Wafer mask aligner
Wafer substrate aligner / bonder
CL200
Flip-chip die bonder
ABC200
Wafer spin coater
max. 300 mm | ACS300 Gen2
Prototyping machines
Nano-imprint photolithography system
Exhibitor's categories
Machines for electronics production
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Prototyping machines
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Inspection machines for the electronics industry
standListOtherProduct www di En 2012-06-22-03
