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Suss MicroTec
 

Wafer substrate aligner / bonder
CL200 Suss MicroTec

In MEMS, 3D Integration applications it is essential to minimize the time between clean wafers using wet chemistry and bonding. The SUSS CL200/CL8 effectively removes particles from wafer surfaces using SC-1 or SC-2 chemistry and megasonic cleaning. The wafers are then spun dry with notch to notch alignment and automated wafer contacting.

While the CL8 is a stand-alone system, the CL200 is a process module that can be integrated into an ABC200 bond cluster system.
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