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Synova
Synova
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Exhibitor's key-words
Laser cutting machine
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Cutting machine
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Drilling machine
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Drill
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Laser drilling machine
Laser drilling machine
Synova
The Laser-Edge Grinding machine was developed to grind the edge of thin wafers in order to remove micro cracks. This advanced process reduces wafer breakage, facilitates handling and enhances wafer fracture strength.
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10 Products
Synova
sorted by category
Drilling machines, Drilling centers
Laser cutting, Laser machining
Water jet guided laser cutting machine
300 x 300 mm | DCS 300
Laser stencil cutting machine
830 x 1250 mm | LSS 1200
Laser stencil cutting machine
830 x 1050 mm | LSS 1000
Laser wafer dicing machine
320 x 320 mm | LDS 300 A
Water jet guided laser cutting machine
150 x 150 mm | LCS 150
Laser wafer dicing machine
240 x 240 mm | LDS 200 series
Laser stencil cutting machine
630 x 850 mm | LSS 800 series
Water jet guided laser cutting machine
300 x 300 mm | LCS 300
Laser wafer dicing machine
310 x 310 mm | HLS 300 A
Exhibitor's categories
Laser cutting, Laser machining
|
Machines for electronics production
|
Drilling machines, Drilling centers
standListOtherProduct www di En 2012-06-22-03
