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Synova
 

Laser wafer dicing machine
240 x 240 mm | LDS 200 series Synova

The Laser Dicing System is primarily designed for semiconductor back-end processing, mainly wafer dicing and grooving applications.

The LDS 200 A is a fully automatic, cassette-to-cassette wafer dicing machine including fast quality check (control of kerf width, position and roughness).
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standListOtherProduct www di En 2012-02-07-15