Laser wafer dicing machine
310 x 310 mm | HLS 300 A
Synova
The fully automatic Hybrid Laser Saw integrates technologies from both Disco and Synova : Disco’s leading-edge dual-parallel spindle, fully automatic Dicing Saw and Synova’s Laser MicroJet® (LMJ) optical head module. This “2-in 1” turnkey system can dice up to 300 mm wafers in a fully automatic mode from cassette to cassette. This dual-approach offers optimum dicing results, both in throughput and yield, and provides users with the best of both worlds enabling top-quality and high yield processing results.
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