Glass fiber fabric / epoxy resin prepreg
TacPreg® Taconic International Ltd.

TacPreg® and TacLam® are the result of Taconic’s expertise and extensive experience in providing the printed circuit board market with state-of-the-art high performance laminate materials.

TacPreg® is an excellent prepreg for other Taconic products including, but not limited to, RF-35 and RF-35P.

TacLam® laminates are designed for thin core, high speed digital applications requiring excellent electrical performance. TacLam® laminates are a combination of fluoropolymer resin based on woven fiberglass reinforcement, BT epoxy, and ceramic. TacLam® is made from, and used in conjunction with, TacPreg® prepregs.

The TacPreg® / TacLam® system is dimensionally stable due to the woven fiberglass reinforcement used in its design. TacPreg® enables foil lamination processing in either digital or RF board designs.

The TacPreg® / TacLam® system can be processed using typical epoxy processes and lamination cycles, detailed below. Vacuum lamination is recommended.

•Heat rise 10°F /5°C/min to 392°F / 200°C (flow window 200°F/93°C - 302°F/150°C)
•Kiss pressure 73 psi / 5 bar until package reaches 150°F/66°C then apply full pressure (450 psi /31 bar)
•Hold (cure) for 1 hour
•Cool down under pressure at <6°F/3°C /min
•Inner-layer copper should be treated with an oxide or alternative treatment