Thermally conductive silicone compound
6.5 W/mK | Alpha gel®
Taica Corporation
No-cure, 1-part thermal paste DP series:
*Easy to apply: 1-part, no-cure.
*Running and vaporization problems to nearly disappear due to cross-linked particle structure.
*High thermal conductivity up to 6.5 W/mK.
*Adoption example are optical transceiver, infrastructure, automobile..
*Easy to apply: 1-part, no-cure.
*Running and vaporization problems to nearly disappear due to cross-linked particle structure.
*High thermal conductivity up to 6.5 W/mK.
*Adoption example are optical transceiver, infrastructure, automobile..
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