- Packing - Handling - Logistics
- Handling and Lifting
- TDK Electronics Europe
Wafer materials handling system TAS300
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Characteristics
- Product applications
- wafer
Description
TDK is proud to introduce it's Contamination Free, Clean Technology!
Our new TAS300 FOUP Loadport is matching the latest requirements of the Semiconductor Industry.
It is offers High Reliability and is Particle Contamination Free!
Advantages:
Compatibility of pod
Cushion mechanism that allows secure opening and closing of FOUP of each company
Entegris
Shin-Etsu Polymer
Kakizaki Mfg.
Dainichi Shoji
Asyst
Particle free based on the total clean technology
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.