Thermal protector
TE Circuit protection
life, and reliability requirements of automotive and industrial applications, including shock,
vibration, temperature cycling, and humidity exposures. In the field, the RTP device opens
if its internal junction exceeds the device's specified open temperature. Temperature
increases can have multiple sources, one of which is component failure (i.e. when using
power components such as a power FET, capacitor, resistor, triac, etc.). The RTP device
open temperature is selected so that the device does not open within normal component
operating windows, but it does open in a thermal runaway event and before the melt
temperature of typical lead free solders.
To simplify installation, improve reliability, and optimize thermal coupling with the PCB,
the RTP device is surface mountable. No special SMD installation is required. Instead,
after installation, the RTP device utilizes a one time electronic arming process to become
thermally sensitive. Before the arming procedure, the device can go through installation
temperatures up to 260°C without going open. After arming, the device will open when
the critical junction exceeds the open temperature. Arming can occur during test, or in
the field.
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