adhesive label / thermal transfer / printable / barcode
T1K Series TE CONNECTIVITY - Identification Products

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Characteristics

  • Type:

    adhesive, thermal transfer, printable, barcode

  • Material:

    polyimide

  • Product applications:

    for printed circuit boards

  • Other characteristics:

    high-temperature

  • Thickness:

    63 µm

Description

TE’s polyimide labels are all ideal for high temperature labelling requirements such as printed circuit boards. They are suitable for direct wave (bottom side) and IR reflow (top side) PCB applications. TE’s polyimide labels are designed to withstand the fluxes, cleaning solvents and molten solder encountered in the manufacture of printed circuit boards. They offer excellent contrast for bar code applications. TE’s polyimide labels are suitable for the harshest high temperature applications.

Features and benefits
- Thermal transfer printable
- Low profile 1 mil polymide film
- Gloss white topcoat
- Withstands surface mount board processes on either the top or bottom side of the board
- Ideal for manual apply applications

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