Pick and place handling module
TLC
High-Precision Mounting
Both the fixed-position and moving cameras contribute to achieving high-precision mounting. This enables the cellular mounter to easily respond to smaller PWBs and higher-density mounting requirements, such as handling BGA/CSP mounting with a finer grid pitch.
Supporting Wider Range of Parts
The cellular mounter can be used to process products ranging from microchip parts to large connectors. Despite its compact size, its feeder units are designed to accommodate up to 40 cassettes (front) and 80 trays (rear), making it possible for a single machine to mount high-density PWBs.
Pursuing Space-Saving Design and Operability
The cellular mounter is only 1.2 m wide, while supporting a PWB size as large as 460 mm × 360 mm. It offers the highest level of space efficiency.
Placement tact time: 7,350CPH(0.49sec/movable camera)2,500CPH(1.4sec/fixed camera)
Placement precision: ±0.06mm (chip)
Component size: 2012-□32mm(movable camera/reflective imaging)/2012-□19mm(movable camera/transmissive imaging) 2012-□18mm (fixed camera/reflective imaging) □18-□43mm(fixed camera/reflective imaging,medium view range,batch) -φ150mm(fixed camera reflective, medium, large view range, division into 4)
thickness:Max.25mm
External dimentions: 1,220(W)mm x 1,700(D)mm x 1,524(H)mm
Both the fixed-position and moving cameras contribute to achieving high-precision mounting. This enables the cellular mounter to easily respond to smaller PWBs and higher-density mounting requirements, such as handling BGA/CSP mounting with a finer grid pitch.
Supporting Wider Range of Parts
The cellular mounter can be used to process products ranging from microchip parts to large connectors. Despite its compact size, its feeder units are designed to accommodate up to 40 cassettes (front) and 80 trays (rear), making it possible for a single machine to mount high-density PWBs.
Pursuing Space-Saving Design and Operability
The cellular mounter is only 1.2 m wide, while supporting a PWB size as large as 460 mm × 360 mm. It offers the highest level of space efficiency.
Placement tact time: 7,350CPH(0.49sec/movable camera)2,500CPH(1.4sec/fixed camera)
Placement precision: ±0.06mm (chip)
Component size: 2012-□32mm(movable camera/reflective imaging)/2012-□19mm(movable camera/transmissive imaging) 2012-□18mm (fixed camera/reflective imaging) □18-□43mm(fixed camera/reflective imaging,medium view range,batch) -φ150mm(fixed camera reflective, medium, large view range, division into 4)
thickness:Max.25mm
External dimentions: 1,220(W)mm x 1,700(D)mm x 1,524(H)mm
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