Wafer dicing machine
Toyo Advanced technologies
High-precision scroll finish machining, even without warming-up and adjustment during operation
Long-term stability of profile accuracy with the newly-developed "CCPC" Constant Cutting-Point Control (patent U.S.pat.)
Thoroughgoing heat displacement countermeasures in combination with a system-integrated automatic thickness gauge (optional) can give high accuracy of 5 µm or better.
